PACKAGE MATERIALS INFORMATION
www.ti.com
26-May-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
ULN2003ADR
ULN2003ADR
ULN2003AIDR
ULN2003AIPWR
ULN2003ANSR
ULN2003APWR
ULN2004ADR
ULN2004ADR
ULN2004ANSR
SOIC
SOIC
SOIC
TSSOP
SO
D
D
16
16
16
16
16
16
16
16
16
2500
2500
2500
2000
2000
2000
2500
2500
2000
346.0
333.2
333.2
346.0
346.0
346.0
333.2
346.0
346.0
346.0
345.9
345.9
346.0
346.0
346.0
345.9
346.0
346.0
33.0
28.6
28.6
29.0
33.0
29.0
28.6
33.0
33.0
D
PW
NS
PW
D
TSSOP
SOIC
SOIC
SO
D
NS
Pack Materials-Page 2