PACKAGE OPTION ADDENDUM
www.ti.com
23-Jun-2010
Orderable Device
ULN2003APWRE4
ULN2003APWRG4
ULN2004AD
ULN2004ADE4
ULN2004ADG4
ULN2004ADR
ULN2004ADRE4
ULN2004ADRG4
ULN2004AN
ULN2004ANE4
ULN2004ANSR
ULN2004ANSRG4
ULQ2003AD
ULQ2003ADG4
ULQ2003ADR
ULQ2003ADRG4
ULQ2003AN
ULQ2004AD
Status
(1)
Package Type Package
Drawing
TSSOP
TSSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
SO
SOIC
SOIC
SOIC
SOIC
PDIP
SOIC
PW
PW
D
D
D
D
D
D
N
N
NS
NS
D
D
D
D
N
D
Pins
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
Package Qty
2000
2000
40
40
40
2500
2500
2500
25
25
2000
2000
40
40
2500
2500
25
40
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
Contact TI Distributor
or Sales Office
Contact TI Distributor
or Sales Office
Contact TI Distributor
or Sales Office
Contact TI Distributor
or Sales Office
Contact TI Distributor
or Sales Office
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Pb-Free (RoHS)
Pb-Free (RoHS)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Pb-Free (RoHS)
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 3
TI [ TEXAS INSTRUMENTS ]
