PACKAGE OPTION ADDENDUM
www.ti.com
22-Aug-2007
Orderable Device
ULN2004ADR
ULN2004ADRE4
ULN2004ADRG4
ULN2004AN
ULN2004ANE4
ULN2004ANSR
ULN2004ANSRG4
ULQ2003AD
ULQ2003ADG4
ULQ2003ADR
ULQ2003ADRG4
ULQ2003AN
ULQ2004AD
ULQ2004ADG4
ULQ2004ADR
ULQ2004ADRG4
ULQ2004AN
(1)
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NRND
ACTIVE
NRND
ACTIVE
ACTIVE
NRND
ACTIVE
NRND
ACTIVE
ACTIVE
Package
Type
SOIC
SOIC
SOIC
PDIP
PDIP
SO
SO
SOIC
SOIC
SOIC
SOIC
PDIP
SOIC
SOIC
SOIC
SOIC
PDIP
Package
Drawing
D
D
D
N
N
NS
NS
D
D
D
D
N
D
D
D
D
N
Pins Package Eco Plan
(2)
Qty
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
25
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-260C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-260C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
40
40
2500
Pb-Free
(RoHS)
Green (RoHS &
no Sb/Br)
Pb-Free
(RoHS)
2500 Green (RoHS &
no Sb/Br)
25
40
40
2500
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Green (RoHS &
no Sb/Br)
Pb-Free
(RoHS)
2500 Green (RoHS &
no Sb/Br)
25
Pb-Free
(RoHS)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 2
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