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UCC3912DP 参数 Datasheet PDF下载

UCC3912DP图片预览
型号: UCC3912DP
PDF下载: 下载PDF文件 查看货源
内容描述: 可编程热插拔电源管理器 [Programmable Hot Swap Power Manager]
分类和应用: 光电二极管信息通信管理
文件页数/大小: 6 页 / 151 K
品牌: TI [ TEXAS INSTRUMENTS ]
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UCC3912
ABSOLUTE MAXIMUM RATINGS
VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8 V
FAULT Sink Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
FAULT Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 to V
IN
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Limiting
Input Voltage
(B0, B1, B2, B3, IMAX, SHTDWN) . . . . . . . . . . . –0.3 to V
IN
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Operating Junction Temperature Range . . . . –55°C to +150°C
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300°C
DESCRIPTION (cont.)
The UCC3912 is designed for unidirectional current flow,
emulating an ideal diode in series with the power switch.
This feature is particularly attractive in applications
where many devices are powering a common bus, such
as with SCSI Termpwr.
The UCC3912 can be put into sleep mode drawing only
1µA of supply current. The SHTDWN pin has a preset
threshold hysteresis which allows the user the ability to
set a time delay upon start-up to achieve sequencing of
power. Other features include an open drain FAULT out-
put indicator, Thermal Shutdown, Under Voltage Lock-
out, and a low thermal resistance Small outline package.
Currents are positive into, negative out of the specified termi-
nal. Consult Packaging Section of Databook for thermal limita-
tions and considerations of packages.
CONNECTION DIAGRAMS
DIL-16, SOIC-16 (Top View)
N, DP Package
TSSOP-24 (Top View)
PWP Package
SHTDWN
VIN
VIN
N/C
GND*
GND*
GND*
GND*
EGND*
B3
B2
B1
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
FAULT
VOUT
VOUT
N/C
GND*
GND*
GND*
GND*
GND*
CT
IMAX
B0
*Pin
5 serves as lowest impedance to the electrical ground;
Pins 4, 12, and 13 serve as heat sink/ground. These pins
should be connected to large etch areas to help dissipate
heat. For N package, pins 4, 12, and 13 are N/C.
*Pin
9 serves as lowest impedance to the electrical ground;
other GND pins serve as heat sink/ground. These pins
should be connected to large etch areas to help dissipate
heat.
ELECTRICAL CHARACTERISTICS:
Unless otherwise stated, these specifications apply for T
J
= 0°C to 70°C, VIN = 5V,
IMAX = 0.4V, SHTDWN = 2.4V.
PARAMETER
Supply Section
Voltage Input Range
Supply Current
Sleep Mode Current
Output Section
Voltage Drop
TEST CONDITIONS
MIN
3.0
SHTDWN = 0.2V
I
OUT
= 1A
I
OUT
= 2A
I
OUT
= 3A
I
OUT
= 1A, VIN = 3V
I
OUT
= 2A, VIN = 3V
I
OUT
= 3A, VIN = 3V
1.0
0.5
0.15
0.3
0.45
0.17
0.35
0.5
TYP
MAX UNITS
8.0
2.0
5.0
0.22
0.45
0.68
0.27
0.56
0.8
V
mA
µA
V
V
V
V
V
V
2