PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
UCC1895J
UCC1895L
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PREVIEW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
J
20
20
20
20
20
20
20
20
20
20
20
20
20
1
None
None
None
None
None
None
None
None
None
None
None
None
A42 SNPB
Level-NC-NC-NC
LCCC
SOIC
FK
1
POST-PLATE Level-NC-NC-NC
UCC2895DW
UCC2895DWTR
UCC2895N
DW
DW
N
25
CU SNPB
CU SNPB
CU SNPB
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
Level-NA-NA-NA
SOIC
2000
20
PDIP
UCC2895PW
TSSOP
TSSOP
TSSOP
PLCC
PLCC
SOIC
PW
PW
PW
FN
70
CU NIPDAU Level-2-220C-1 YEAR
CU NIPDAU Level-2-220C-1 YEAR
UCC2895PWTR
UCC2895PWTRG4
UCC2895Q
2000
2000
46
Call TI
Call TI
CU SNPB
CU SNPB
CU SNPB
CU SNPB
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
UCC2895QTR
UCC3895DW
UCC3895DWTR
UCC3895DWTRG4
FN
1000
25
DW
DW
DW
SOIC
2000
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UCC3895N
UCC3895PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
N
20
20
20
20
20
70
None
None
None
CU SNPB
Level-NA-NA-NA
TSSOP
TSSOP
TSSOP
PW
PW
PW
CU NIPDAU Level-2-220C-1 YEAR
CU NIPDAU Level-2-220C-1 YEAR
UCC3895PWTR
UCC3895PWTRG4
2000
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UCC3895Q
ACTIVE
ACTIVE
PLCC
PLCC
FN
FN
20
20
46
None
None
CU SNPB
CU SNPB
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
UCC3895QTR
1000
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 1
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