PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
UCC27523DGNR
UCC27523DR
MSOP-PowerPAD
DGN
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
3000
250
364.0
367.0
367.0
210.0
364.0
367.0
367.0
210.0
364.0
367.0
367.0
210.0
367.0
210.0
364.0
367.0
367.0
185.0
364.0
367.0
367.0
185.0
364.0
367.0
367.0
185.0
367.0
185.0
27.0
35.0
35.0
35.0
27.0
35.0
35.0
35.0
27.0
35.0
35.0
35.0
35.0
35.0
SOIC
UCC27523DSDR
UCC27523DSDT
UCC27524DGNR
UCC27524DR
SON
DSD
DSD
DGN
D
SON
MSOP-PowerPAD
SOIC
2500
2500
3000
250
UCC27524DSDR
UCC27524DSDT
UCC27525DGNR
UCC27525DR
SON
DSD
DSD
DGN
D
SON
MSOP-PowerPAD
SOIC
2500
2500
3000
250
UCC27525DSDR
UCC27525DSDT
UCC27526DSDR
UCC27526DSDT
SON
DSD
DSD
DSD
DSD
SON
SON
3000
250
SON
Pack Materials-Page 2
TI [ TEXAS INSTRUMENTS ]
