PACKAGE OPTION ADDENDUM
www.ti.com
4-May-2009
PACKAGING INFORMATION
Orderable Device
UC2872DW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
16
16
16
16
14
14
20
20
16
16
16
16
16
16
16
16
14
14
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC2872DWG4
UC2872DWTR
UC2872DWTRG4
UC2872N
SOIC
SOIC
SOIC
PDIP
PDIP
PLCC
PLCC
SOIC
SOIC
SOIC
SOIC
DW
DW
DW
N
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UC2872NG4
UC2872Q
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
FN
46 Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC2872QG3
UC3872DW
FN
46 Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
DW
DW
DW
DW
DBQ
DBQ
DBQ
DBQ
N
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC3872DWG4
UC3872DWTR
UC3872DWTRG4
UC3872M
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC3872MG4
UC3872MTR
UC3872MTRG4
UC3872N
SSOP/
QSOP
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
PDIP
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UC3872NG4
PDIP
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
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