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SLUS329E – MONTH 2003 – REVISED JANUARY 2008
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
V
CC
T
J
Supply voltage
UC1854X
Operating junction temperature
UC2854X
UC3854X
10
–55
–40
0
MAX
20
125
85
70
°C
UNIT
V
THERMAL RESISTANCE
PACKAGED DEVICES
RESISTANCES
θ
JC
(°C/W)
θ
JA
(°C/W)
(1)
(2)
CDIP-16
(J)
28
(1)
80–120
PDIP-16
(N)
45
90
(2)
SOP-16
(DW)
27
50–130
(2)
PLCC-20
(Q)
34
43–75
(2)
θ
JC
data values stated are derived from MIL-STD-1835B which states gthe baseline values shown are worst case (mean +2s) for a 60
×
60 mil microcircuit device silicon die and applicable for devices with die sizes up to 14,400 square mils. For device die sizes greater than
14,400 square mils use the following values, dual-in-line, 11°C/W; flat pack and pin grid array, 10°C/W.are at the end of each trace.
θ
JA
(junction-to-ambient) applies to devices mounted to five square inch FR4 PC board with one ounce copper where noted. When
resitance range is given, lower values are for five square inch aluminum PC board. Test PWB is 0.062 inches thick and typically uses
0,635 mm trace widths for power packages and 1,3 mm trace widths for non-power packages with a 100
×
100 mil probe land are at the
end of each trace.
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