µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
µA741Y chip information
This chip, when properly assembled, displays characteristics similar to the µA741C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
CC+
(7)
(3)
(2)
(7)
(6)
IN+
+
–
(6)
OUT
IN–
OFFSET N1
OFFSET N2
(4)
(1)
(5)
(8)
V
CC–
45
(5)
(4)
(1)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T max = 150°C.
J
(2)
(3)
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
36
3
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