PACKAGE OPTION ADDENDUM
www.ti.com
18-Nov-2006
PACKAGING INFORMATION
Orderable Device
UA741CD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UA741CDE4
UA741CDG4
UA741CDR
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UA741CDRE4
UA741CDRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UA741CJG
UA741CJG4
UA741CP
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
PDIP
JG
JG
P
8
8
8
TBD
TBD
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50
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
UA741CPE4
UA741CPSR
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
P
8
8
8
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
PS
PS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UA741CPSRE4
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UA741MFKB
UA741MJ
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
LCCC
CDIP
CDIP
CDIP
CDIP
FK
J
20
14
14
8
TBD
TBD
TBD
TBD
TBD
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UA741MJB
UA741MJG
UA741MJGB
J
JG
JG
8
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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