DBV 5
DBV 6
YEQ, YZQ
TPS793xx
SLVS348K – JULY 2001 – REVISED OCTOBER 2007
www.ti.com
ULTRALOW-NOISE, HIGH PSRR, FAST RF 200mA LOW-DROPOUT LINEAR
REGULATORS IN NanoStar™ WAFER CHIP SCALE AND SOT23
1
FEATURES
DESCRIPTION
The TPS793xx family of low-dropout (LDO)
low-power linear voltage regulators features high
power-supply rejection ratio (PSRR), ultralow-noise,
fast start-up, and excellent line and load transient
responses in NanoStar wafer chip scale and SOT23
packages. NanoStar packaging gives an ultrasmall
footprint as well as an ultralow profile and package
weight, making it ideal for portable applications such
as handsets and PDAs. Each device in the family is
stable, with a small 2.2μF ceramic capacitor on the
output. The TPS793xx family uses an advanced,
proprietary BiCMOS fabrication process to yield
extremely low dropout voltages (for example, 112mV
at 200mA, TPS79330). Each device achieves fast
start-up times (approximately 50μs with a 0.001μF
bypass capacitor) while consuming very low
quiescent current (170μA typical). Moreover, when
the device is placed in standby mode, the supply
current is reduced to less than 1μA. The TPS79328
exhibits approximately 32μV
RMS
of output voltage
noise at 2.8V output with a 0.1μF bypass capacitor.
Applications with analog components that are
noise-sensitive, such as portable RF electronics,
benefit from the high PSRR and low-noise features
as well as the fast response time.
TPS79328
•
200mA RF Low-Dropout Regulator
With Enable
•
Available in Fixed Voltage Versions from 1.8V
to 4.75V and Adjustable (1.22V to 5.5V)
•
High PSRR (70dB at 10kHz)
•
Ultralow-Noise (32μV
RMS
, TPS79328)
•
Fast Start-Up Time (50μs)
•
Stable With a 2.2μF Ceramic Capacitor
•
Excellent Load/Line Transient Response
•
Very Low Dropout Voltage (112mV at 200mA,
TPS79330)
•
5- and 6-Pin SOT23 (DBV) and NanoStar Wafer
Chip Scale (YEQ, YZQ) Packages
234
APPLICATIONS
•
•
•
•
•
RF: VCOs, Receivers, ADCs
Audio
Cellular and Cordless Telephones
Bluetooth
®
, Wireless LAN
Handheld Organizers, PDAs
DBV PACKAGE
(TOP VIEW)
TPS79328
IN
GND
EN
1
2
3
4
NR
5
OUT
0.30
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
100
V
IN
= 3.8 V
C
OUT
= 2.2
µF
C
NR
= 0.1
µF
90
80
RIPPLE REJECTION
vs
FREQUENCY
I
OUT
= 200 mA
Fixed Option
DBV PACKAGE
(TOP VIEW)
IN
GND
EN
1
2
3
6
5
4
OUT
FB
NR
Output Spectral Noise Density (µV/√Hz)
0.25
0.20
Ripple Rejection (dB)
70
60
50
40
30
20
10
V
IN
= 3.8 V
C
OUT
= 10
µF
C
NR
= 0.01
µF
10
100
1k
10 k
100 k
1M
10 M
I
OUT
= 10 mA
0.15
I
OUT
= 1 mA
0.10
I
OUT
= 200 mA
0.05
Adjustable Option
YEQ, YZQ
PACKAGE
(TOP VIEW)
IN
C3
A3
C1
B2
A1
OUT
NR
GND
0
100
1k
10 k
Frequency (Hz)
100 k
0
Frequency (Hz)
EN
Figure 1.
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar is a trademark of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
All other trademarks are the property of their respective owners.
Copyright © 2001–2007, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TI [ TEXAS INSTRUMENTS ]
