EXAMPLE BOARD LAYOUT
RNN0018A
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(2.5)
2X (1.65)
5X (0.5)
SYMM
18
13
8X (0.6)
(1.65)
8X (0.25)
(R0.05) TYP
1
EXPOSED METAL
TYP
12
2X (0.925)
2X (0.4)
11
2X (0.35)
2
PKG
0.000
2X
(2.6)
2X (0.3)
(0.65)
2X (0.85)
8
2X (1.4)
5
6X (0.25)
8X (1.15)
6
7
2X (0.3)
2X (0.3)
8X (1.375)
LAND PATTERN EXAMPLE
SOLDER MASK DEFINED
EXPOSED METAL SHOWN
SCALE:25X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
SOLDER MASK
OPENING
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
SOLDER MASK DETAILS
(PREFERRED)
4222688/E 03/2021
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
4. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
TI [ TEXAS INSTRUMENTS ]
