SLVS795B – OCTOBER 2008 – REVISED DECEMBER 2008
..........................................................................................................................................
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
T
J
–40°C to 150°C
(1)
(2)
PACKAGE
10 Pin MSOP
PART NUMBER
(2)
TPS54160DGQ
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at
The DGQ package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54160DGQR).
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating temperature range (unless otherwise noted).
VALUE
VIN
EN
BOOT
Input voltage
VSENSE
COMP
PWRGD
SS/TR
RT/CLK
BOOT-PH
Output voltage
Voltage Difference
PH
PH, 10-ns Transient
PAD to GND
EN
BOOT
Source current
VSENSE
PH
RT/CLK
VIN
Sink current
COMP
PWRGD
SS/TR
Electrostatic Discharge (HBM) QSS 009-105 (JESD22-A114A)
Electrostatic Discharge (CDM) QSS 009-147 (JESD22-C101B.01)
Operating junction temperature
Storage temperature
(1)
–0.3 to 65
–0.3 to 5
73
–0.3 to 3
–0.3 to 3
–0.3 to 6
–0.3 to 3
–0.3 to 3.6
8
–0.6 to 65
–2 to 65
±200
100
100
10
Current Limit
100
Current Limit
100
10
200
1
500
–40 to 150
–65 to 150
mV
µA
mA
µA
A
µA
A
µA
mA
µA
kV
V
°C
°C
V
V
UNIT
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2
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