TPS54610
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SLVS398F–JUNE 2001–REVISED APRIL 2007
LAYOUT CONSIDERATIONS FOR THERMAL
PERFORMANCE
plane layer must be made using 0.013 inch diameter
vias to avoid solder wicking through the vias. Eight
vias must be in the PowerPAD area with four
additional vias located under the device package.
The size of the vias under the package, but not in
the exposed thermal pad area, can be increased to
0.018. Additional vias beyond the twelve
recommended that enhance thermal performance
must be included in areas not under the device
package.
For operation at full rated load current, the analog
ground plane must provide an adequate heat
dissipating area. A 3-inch by 3-inch plane of 1 ounce
copper is recommended, though not mandatory,
depending on ambient temperature and airflow. Most
applications have larger areas of internal ground
plane available, and the PowerPAD must be
connected to the largest area available. Additional
areas on the top or bottom layers also help dissipate
heat, and any area available must be used when 6 A
or greater operation is desired. Connection from the
exposed area of the PowerPAD to the analog ground
Minimum Recommended Thermal Vias: 8 x 0.013 Diameter Inside
Powerpad Area 4 x 0.018 Diameter Under Device as Shown.
Additional 0.018 Diameter Vias May Be Used if Top Side Analog Ground
Area Is Extended.
q 0.0130
8 PL
4 PL q 0.0180
Connect Pin 1 to Analog Ground Plane
in This Area for Optimum Performance
0.0150
0.06
0.0339
0.0650
0.0500
0.3820 0.3478
0.0500
0.2090
0.0256
0.0500
0.0650
0.0339
Minimum Recommended Exposed
Copper Area for Powerpad. 5mm
0.1700
Stencils May Require 10 Percent
Larger Area
0.1340
Minimum Recommended Top
Side Analog Ground Area
0.0630
0.0400
Figure 12. Recommended Land Pattern for 28-Pin PWP PowerPAD
11
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