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TPS54310
SLVS412A – DECEMBER 2001 – REVISED JUNE 2002
MECHANICAL DATA
PWP (R-PDSO-G**)
20 PINS SHOWN
PowerPAD PLASTIC SMALL-OUTLINE
0,65
20
0,30
0,19
11
0,10
M
Thermal Pad
(See Note D)
4,50
4,30
6,60
6,20
0,15 NOM
Gage Plane
1
A
10
0°– 8°
0,25
0,75
0,50
Seating Plane
1,20 MAX
0,15
0,05
PINS **
DIM
A MAX
A MIN
0,10
14
5,10
4,90
16
5,10
4,90
20
6,60
6,40
24
7,90
7,70
28
9,80
9,60
4073225/F 10/98
NOTES:A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusions.
The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
PowerPAD is a trademark of Texas Instruments.
13
TI [ TEXAS INSTRUMENTS ]
