TPS40210-Q1, TPS40211-Q1
SLVS861D –AUGUST 2008–REVISED APRIL 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
TJ
VFB (TYP)
PACKAGE(2)
700 mV
260 mV
MSOP PowerPAD™ – DGQ
MSOP PowerPAD™ – DGQ
Reel of 2500
Reel of 2500
TPS40210QDGQRQ1
TPS40211QDGQRQ1
4210Q
4211Q
–40°C to 125°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
DEVICE RATINGS
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
VDD
–0.3 V to 52 V
–0.3 V to 10 V
–0.3 V to 8 V
Input voltage range
RC, SS, FB, DIS/EN
ISNS
Output voltage range
COMP, BP, GDRV
–0.3 V to 9 V
TJ
Operating junction temperature range
Storage temperature range
–40°C to 150°C
–55°C to 150°C
Tstg
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN
4.5
MAX UNIT
VVDD
TJ
Input voltage
52
V
Operating junction temperature
–40
125
°C
PACKAGE DISSIPATION RATINGS
AIRFLOW
R
qJA HIGH-K BOARD(1)
(°C/W)
POWER RATING (W)
TA = 25°C
POWER RATING (W)
TA = 85°C
PACKAGE
(LFM)
10-Pin MSOP PowerPAD
0 (Natural Convection)
(DGQ)
57.7
1.73
0.693
(1) Ratings based on JEDEC high thermal conductivity (High K) board. For more information on the test method, see TI technical brief
SZZA017.
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
TYP
1500
1500
UNIT
Human-Body Model (HBM)
V
Charged-Device Model (CDM)
2
Submit Documentation Feedback
Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS40210-Q1 TPS40211-Q1
TI [ TEXAS INSTRUMENTS ]
