PACKAGE MATERIALS INFORMATION
www.ti.com
6-Dec-2008
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS2044BDR
TPS2051BDBVR
TPS2051BDBVT
TPS2051BDGNR
TPS2051BDR
SOIC
SOT-23
D
DBV
DBV
DGN
D
16
5
2500
3000
250
333.2
195.0
195.0
370.0
340.5
370.0
340.5
370.0
195.0
333.2
333.2
345.9
200.0
200.0
355.0
338.1
355.0
338.1
355.0
200.0
345.9
345.9
28.6
45.0
45.0
55.0
20.6
55.0
20.6
55.0
45.0
28.6
28.6
SOT-23
5
MSOP-PowerPAD
SOIC
8
2500
2500
2500
2500
3000
250
8
TPS2052BDGNR
TPS2052BDR
MSOP-PowerPAD
SOIC
DGN
D
8
8
TPS2052BDRBR
TPS2052BDRBT
TPS2053BDR
SON
DRB
DRB
D
8
SON
8
SOIC
16
16
2500
2500
TPS2054BDR
SOIC
D
Pack Materials-Page 3
TI [ TEXAS INSTRUMENTS ]
