SLVS514J – APRIL 2004 – REVISED DECEMBER 2008
..................................................................................................................................................
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTION AND ORDERING INFORMATION
RECOMMENDED
MAXIMUM
CONTINUOUS
LOAD CURRENT
TYPICAL
SHORT-
CIRCUIT
CURRENT
LIMIT
AT 25°C
PACKAGED DEVICES
(1)
NUMBER OF
SWITCHES
(2)
T
A
ENABLE
MSOP (DGN)
SOIC (D)
SOT-23 (DBV)
SON (DRB)
Active low
Active high
Active low
-40°C to
85°C
Active high
Active low
Active high
Active low
Active high
0.5 A
1A
Single
Single
Dual
Dual
Triple
Triple
Quad
Quad
TPS2041BDGN
TPS2051BDGN
TPS2042BDGN
TPS2052BDGN
--
--
--
--
TPS2041BD
TPS2051BD
TPS2042BD
TPS2052BD
TPS2043BD
TPS2053BD
TPS2044BD
TPS2054BD
TPS2041BDBV
TPS2051BDBV
TPS2042BDRB
TPS2052BDRB
(1)
(2)
The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2042BDR)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
UNIT
Input voltage range, V
I(IN)
, V
I(INx)
(2)
-0.3 V to 6 V
-0.3 V to 6 V
-0.3 V to 6 V
-0.3 V to 6 V
Internally limited
See Dissipation Rating Table
-40°C to 125°C
-65°C to 150°C
260°C
2 kV
500 V
Human body model MIL-STD-883C
Charge device model (CDM)
Output voltage range, V
O(OUT)
, V
O(OUTx) (2)
Input voltage range, V
I(EN)
, V
I(ENx)
, V
I(EN)
, V
I(ENx)
Voltage range, V
I(/OC)
, V
I(OCx)
Continuous output current, I
O(OUT)
, I
O(OUTx)
Continuous total power dissipation
Operating virtual junction temperature range, T
J
Storage temperature range, T
stg
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds
Electrostatic discharge (ESD) protection
(1)
(2)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to GND.
DISSIPATING RATING TABLE
PACKAGE
DGN-8
D-8
D-16
DBV-5
DRB-8 (Low-K)
(1)
DRB-8 (High-K)
(1)
(2)
(2)
THERMAL
RESISTANCE,
θ
JA
T
A
≤
25°C
POWER RATING
1712.3 mW
585.82 mW
898.47 mW
285 mW
DERATING FACTOR
ABOVE T
A
= 25°C
17.123 mW/°C
5.8582 mW/°C
8.9847 mW/°C
2.85 mW/°C
3.71 mW/°C
16.67 mW/°C
T
A
= 70°C
POWER RATING
941.78 mW
322.20 mW
494.15 mW
155 mW
203 mW
916 mW
T
A
= 85°C
POWER RATING
684.93 mW
234.32 mW
359.38 mW
114 mW
148 mW
866 mW
270 °CW
60 °CW
370 mW
1600 mW
Soldered PowerPAD on a standard 2-layer PCB without vias for thermal pad. See TI application note
for further details.
Soldered PowerPAD on a standard 4-layer PCB with vias for thermal pad. See TI application note
for further details.
2
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