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SLVS953A – JUNE 2009 – REVISED JUNE 2009
2-CHANNEL ESD SOLUTION FOR HIGH-SPEED (6 GBPS) DIFFERENTIAL INTERFACE
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FEATURES
0.05-pF Matching Capacitance Between the
Differential Signal Pair
Single-Pair Differential Lines to Protect the
Differential Data and Clock Lines of the LVDS,
SATA, Ethernet, or USB High-Speed (HS)
Interface
Flow-Through Pin Mapping for the High-Speed
Lines Ensures Zero Additional Skew Due to
Board Layout While Placing ESD-Protection
Chip Near the Connector
Supports Data Rates in Excess of 6 Gbps
ESD Protection Meets or Exceeds
IEC61000-4-2 (Level 4)
5-A Peak Pulse Current (8/20
µs
Pulse) for
V
BUS
and D+, D–, and ID Lines
Industrial Temperature Range: –40°C to 85°C
Multiple Space-Saving Package Options
•
•
DBZ/DRT PACKAGE
(TOP VIEW)
D+
1
3
GND
D–
2
•
DRY PACKAGE
(TOP VIEW)
•
•
•
•
•
•
•
•
N.C.
PR
EV
3
•
•
IE
W
5
4
N.C.
GND
1
2
6
D+
V
CC
D–
N.C. – No internal connection
APPLICATIONS
Notebooks
Set-Top Boxes
DVD Players
Media Players
Portable Computers
DESCRIPTION/ORDERING INFORMATION
The TPD2E009 provides 2 ESD clamp circuits with flow-through pin mapping for ease of board layout. This
device has been designed to protect sensitive components which are connected to ultra high-speed data and
transmission lines. The TPD2E009 offers protection from stress caused by ESD (electrostatic discharge). This
device also offers 5 A (8/20
µs)
peak pulse current ratings per IEC 61000-4-5 (lightning) specification.
The monolithic silicon technology allows matching between the differential signal pairs. The less than differential
0.05-pF capacitance ensures that the differential signal distortion due to added ESD clamp remains minimal. The
0.7-pF line capacitance is suitable for high-speed data rate (in excess of 6 Gbps).
The TPD2E009 conforms to IEC61000-4-2 (Level 4) ESD protection. The DRT (1 mm × 1 mm) package is
offered for space-saving portable applications. The industry standard DBZ (2.4 mm × 2.9 mm) package offers
additional flexibility in the board layout for the system designer.
The TPD2E009 is characterized for operation over ambient air temperature range of –40°C to 85°C.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TI [ TEXAS INSTRUMENTS ]
