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TPA311DR 参数 Datasheet PDF下载

TPA311DR图片预览
型号: TPA311DR
PDF下载: 下载PDF文件 查看货源
内容描述: 单音频放大器\n [Single Audio Amplifier ]
分类和应用: 音频放大器
文件页数/大小: 32 页 / 578 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TPA311  
350-mW MONO AUDIO POWER AMPLIFIER  
SLOS207B – JANUARY 1998 – REVISED MARCH 2000  
Fully Specified for 3.3-V and 5-V Operation  
Shutdown Control  
– I  
– I  
= 7 µA at 3.3 V  
= 60 µA at 5 V  
DD  
DD  
Wide Power Supply Compatibility  
2.5 V – 5.5 V  
BTL to SE Mode Control  
Output Power for R = 8 Ω  
L
– 350 mW at V  
– 250 mW at V  
– 250 mW at V  
= 5 V, BTL  
= 5 V, SE  
= 3.3 V, BTL  
Integrated Depop Circuitry  
DD  
DD  
DD  
Thermal and Short-Circuit Protection  
Surface Mount Packaging  
– SOIC  
– 75 mW at V  
= 3.3 V, SE  
DD  
– PowerPAD MSOP  
D OR DGN PACKAGE  
(TOP VIEW)  
description  
The TPA311 is a bridge-tied load (BTL) or  
single-ended (SE) audio power amplifier devel-  
oped especially for low-voltage applications  
where internal speakers and external earphone  
operation are required. Operating with a 3.3-V  
supply, the TPA311 can deliver 250-mW of  
SHUTDOWN  
BYPASS  
SE/BTL  
IN  
V –  
O
GND  
1
2
3
4
8
7
6
5
V
DD  
V +  
O
continuous power into a BTL 8-load at less than 1% THD+N throughout voice band frequencies. Although  
this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as  
cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the  
output in most applications, which is particularly important for small battery-powered equipment. A unique  
feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive  
is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load.  
This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually  
eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an  
8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by  
50% and height by 40%.  
V
DD  
6
R
F
V
DD  
/2  
C
Audio  
Input  
S
R
I
IN  
4
2
C
V
O
+
C
5
+
C
I
BYPASS  
C
BF  
SHUTDOWN  
SE/BTL  
1
3
350 mW  
+
V
O
8
From System Control  
From HP Jack  
Bias  
Control  
7
GND  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
Copyright 2000, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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