TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
www.ti.com
SPRS439I–JUNE 2007–REVISED MARCH 2011
Device Power Vs SYSCLKOUT
1000.0
900.0
800.0
700.0
600.0
500.0
400.0
300.0
200.0
100.0
0.0
SYSCLKOUT (MHz)
Figure 6-2. Typical Operational Power Versus Frequency (F28335/F28235/F28334/F28234)
NOTE
Typical operational current for 100-MHz devices (28x32) can be estimated from Figure 6-1.
Compared to 150-MHz devices, the analog and flash module currents remain unchanged.
While a marginal decrease in IDDIO current can be expected due to the reduced external
activity of peripheral pins, current reduction is primarily in IDD
.
6.4.3 Thermal Design Considerations
Based on the end application design and operational profile, the IDD and IDDIO currents could vary.
Systems with more than 1 Watt power dissipation may require a product level thermal design. Care should
be taken to keep Tj within specified limits. In the end applications, Tcase should be measured to estimate
the operating junction temperature Tj. Tcase is normally measured at the center of the package top side
surface. The thermal application notes IC Package Thermal Metrics (literature number SPRA953) and
Reliability Data for TMS320LF24xx and TMS320F28xx Devices (literature number SPRA963) help to
understand the thermal metrics and definitions.
Copyright © 2007–2011, Texas Instruments Incorporated
Electrical Specifications
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