TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
SPRS439I–JUNE 2007–REVISED MARCH 2011
www.ti.com
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, ZJZ) and temperature range (for example, A). Figure 5-1 provides a legend for
reading the complete device name for any family member.
TMS 320
F
28335 ZJZ
A
PREFIX
TEMPERATURE RANGE
A = −40°C to 85°C
S = −40°C to 125°C
experimental device
prototype device
qualified device
TMX =
TMP =
TMS =
Q = −40°C to 125°C (Q100 qualification)
DEVICE FAMILY
PACKAGE TYPE
PGF = 176-pin LQFP
PTP = 176-pin PowerPADTM LQFP
320 = TMS320 DSP Family
ZHH = 179-ball MicroStar BGATM (Lead-free)
ZJZ = 176-ball PBGA (Lead-free)
TECHNOLOGY
F = Flash EEPROM (1.9-V Core/3.3-V I/O)
DEVICE
28335
28334
28332
28235
28234
28232
BGA = Ball Grid Array
PBGA = Plastic Ball Grid Array
LQFP = Low-Profile Quad Flatpack
PowerPAD and MicroStar BGA are trademarks of Texas Instruments.
Figure 5-1. Example of F2833x, F2823x Device Nomenclature
110
Device Support
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Product Folder Link(s): TMS320F28335 TMS320F28334 TMS320F28332 TMS320F28235 TMS320F28234
TMS320F28232
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