TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
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SPRS439M –JUNE 2007–REVISED AUGUST 2012
9
Thermal and Mechanical Data
Table 9-1, Table 9-2, Table 9-3, and Table 9-4 show the thermal data. See Section 6.4.3 for more
information on thermal design considerations.
The mechanical package diagrams that follow the tables reflect the most current released mechanical data
available for the designated devices.
Table 9-1. Thermal Model 176-Pin PGF Results
AIR FLOW
PARAMETER
0 lfm
44
150 lfm
34.5
250 lfm
33
500 lfm
31
θJA[°C/W] High k PCB
ΨJT[°C/W]
ΨJB
0.12
28.1
8.2
0.48
0.57
25.9
0.74
25.2
26.3
θJC
θJB
28.1
Table 9-2. Thermal Model 176-Pin PTP Results
AIR FLOW
PARAMETER
0 lfm
17.4
0.2
150 lfm
11.7
0.3
250 lfm
10.1
0.4
500 lfm
8.8
θJA[°C/W] High k PCB
ΨJT[°C/W]
ΨJB
0.5
5.0
4.7
4.7
4.6
θJC
12.1
5.1
θJB
Table 9-3. Thermal Model 179-Ball ZHH Results
AIR FLOW
PARAMETER
0 lfm
32.8
0.09
12.4
8.8
150 lfm
24.1
250 lfm
22.9
500 lfm
20.9
θJA[°C/W] High k PCB
ΨJT[°C/W]
ΨJB
0.3
0.36
0.48
11.8
11.7
11.5
θJC
θJB
12.5
Copyright © 2007–2012, Texas Instruments Incorporated
Thermal and Mechanical Data
187
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