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TMP75 参数 Datasheet PDF下载

TMP75图片预览
型号: TMP75
PDF下载: 下载PDF文件 查看货源
内容描述: 2C精确的数字温度传感器,具有SPI接口 [2C Accurate Digital Temperature Sensor with SPI Interface]
分类和应用: 传感器温度传感器
文件页数/大小: 10 页 / 129 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TMP125
www.ti.com
SBOS323 − DECEMBER 2004
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V
Input Voltage(2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3V to +7V
Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±10mA
Output Short Circuit(3) . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . . . . . −60°C to +150°C
Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . . . . . +150°C
Lead Temperature (soldering) . . . . . . . . . . . . . . . . . . . . . . . . +300°C
ESD Rating (Human Body Model) . . . . . . . . . . . . . . . . . . . . 4000V
(Charged Device Model) . . . . . . . . . . . . . . . . . 1000V
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply
rails should be current limited to 10mA or less.
(3) Short-circuit to ground.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
PRODUCT
TMP125
PACKAGE-LEAD
SOT23-6
PACKAGE DESIGNATOR
DBV
PACKAGE MARKING
T125
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
PIN CONFIGURATION
Top View
TMP125
T125
SOT23−
6
GND
SI
V+
1
2
3
6
5
4
SO
CS
SCK
NOTE: Pin 1 is determined by orienting
the package marking as shown.
2