PACKAGE OPTION ADDENDUM
www.ti.com
20-Oct-2012
PACKAGING INFORMATION
Orderable Device
TMP175AID
TMP175AIDG4
TMP175AIDGKR
TMP175AIDGKRG4
TMP175AIDGKT
TMP175AIDGKTG4
TMP175AIDR
TMP175AIDRG4
TMP75AID
TMP75AIDG4
TMP75AIDGKR
TMP75AIDGKRG4
TMP75AIDGKT
TMP75AIDGKTG4
TMP75AIDR
TMP75AIDRG4
Status
(1)
Package Type Package
Drawing
SOIC
SOIC
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
SOIC
SOIC
SOIC
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
SOIC
D
D
DGK
DGK
DGK
DGK
D
D
D
D
DGK
DGK
DGK
DGK
D
D
Pins
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
Package Qty
75
75
2500
2500
250
250
2500
2500
75
75
2500
2500
250
250
2500
2500
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-250C-1 YEAR
CU NIPDAU Level-2-250C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
Call TI
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
Call TI
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
Addendum-Page 1
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