PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP175AIDGKR
TMP175AIDGKR
TMP175AIDGKT
TMP175AIDGKT
TMP175AIDR
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
DGK
D
8
8
8
8
8
8
8
8
2500
2500
250
366.0
370.0
195.0
366.0
367.0
366.0
366.0
367.0
364.0
355.0
200.0
364.0
367.0
364.0
364.0
367.0
50.0
55.0
45.0
50.0
35.0
50.0
50.0
35.0
250
2500
2500
250
TMP75AIDGKR
TMP75AIDGKT
TMP75AIDR
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
Pack Materials-Page 2