EXAMPLE STENCIL DESIGN
B3QFN - 4.1 mm max height
PLASTIC QUAD FLAT PACK- NO LEAD
RDL0020A
PKG
4X (1.35)
4X (0.45)
16
1
2X (0.925)
17
10X (0.2)
(1.075) TYP
18
PKG
2X (0.538)
10X (0.5)
19
4X (0.825)
10X (0.85)
20
2X (0.875)
9
8
4X (1.53)
(4)
(R0.05) TYP
(4.5)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 17,18, 19 & 20 :
91% PRINTED SOLDER COVERAGE BY AREA
SCALE: 15X
4226416/B 04/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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