PACKAGE OUTLINE
B3QFN - 4.1 mm max height
PLASTIC QUAD FLAT PACK- NO LEAD
RDL0020A
5.1
4.9
A
B
5.6
5.4
PIN 1 INDEX AREA
4.1
3.9
C
SEATING PLANE
0.08
C
1.63
1.53
4X
1.3
1.1
4X
(0.20) TYP
PKG
(0.2) TYP
8
9
0.92
0.82
0.875
20
4X
0.35
0.15
0.1
12X
1.275
PKG
19
18
C
A B
0.05
C
2X (0.537)
2X (1.612)
10X 0.5
17
16
1
0.925
0.6
4X
0.4
0.1
0.8
0.6
C
A B
12X
0.05
C
PIN 1 ID
(OPTIONAL)
4226416/B 04/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
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