TLVM13640
SLVSGJ7 – APRIL 2022
www.ti.com
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Run electrical simulations to see important waveforms and circuit performance.
Run thermal simulations to understand board thermal performance.
Export customized schematic and layout into popular CAD formats.
Print PDF reports for the design, and share the design with colleagues.
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation, see the following:
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Texas Instruments, Innovative DC/DC Power Modules selection guide
Texas Instruments, Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Package
Technology white paper
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Texas Instruments, Benefits and Trade-offs of Various Power-Module Package Options white paper
Texas Instruments, Simplify Low EMI Design with Power Modules white paper
Texas Instruments, Power Modules for Lab Instrumentation white paper
Texas Instruments, An Engineer's Guide To EMI In DC/DC Regulators e-book
Texas Instruments, Soldering Considerations for Power Modules application report
Texas Instruments, Practical Thermal Design With DC/DC Power Modules application report
Texas Instruments, Using New Thermal Metrics application report
Texas Instruments, AN-2020 Thermal Design By Insight, Not Hindsight application report
Texas Instruments, Using the TPSM53602/3/4 for Negative Output Inverting Buck-Boost Applications
application report
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.5 Trademarks
HotRod™ and TI E2E™ are trademarks of Texas Instruments.
WEBENCH® is a registered trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.7 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this datasheet, refer to the left-hand navigation.
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