RHD (S−PQFP−N28)
PLASTIC QUAD FLATPACK
5,00
A
B
5,00
28
1
PIN 1
INDEX AREA
1,00
0,80
0,20 REF
C
SEATING PLANE
0,08
C
0,05 MAX
0,65
3,25
PIN 1
IDENTIFIER
SQ
3,00
28ꢀ
0,45
1
0,435
28
0,18
0,435
4ꢀ 3,00
0,18
0,50
EXPOSED THERMAL
0,30
0,18
DIE PAD
28ꢀ
D
M
C A B
0,10
4204400/A 05/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. QFN (Quad Flatpack No−Lead) Package configuration.
D. The Package thermal performance may be enhanced by bonding the thermal die pad to
an external thermal plane. This pad is electrically and thermally connected to the backside
of the die and possibly selected ground leads.
E. Package complies to JEDEC MO-220.
A−3
TI [ TEXAS INSTRUMENTS ]
