TLV2371-Q1, TLV2372-Q1, TLV2374-Q1
FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS
SGLS244A − MAY 2004 − REVISED JUNE 2008
{
FAMILY PACKAGE TABLE
}
PACKAGE TYPES
NUMBER OF
CHANNELS
UNIVERSAL
EVM BOARD
DEVICE
TLV2371
SOIC
SOT-23 TSSOP MSOP
1
2
4
8
8
5
—
—
14
—
8
See the EVM
Selection Guide
(SLOU060)
TLV2372
TLV2374
—
—
14
—
†
‡
For the most current package and ordering information, see the Package Option Addendum at
the end of this document, or see the TI web site at http://www.ti.com.
Package
drawings,
thermal
data,
and
symbolization
are
available
at
http://www.ti.com/packaging.
TLV2371 AVAILABLE OPTIONS
PACKAGED DEVICES
SOT-23
V
IO
MAX AT
25°C
T
A
SMALL OUTLINE
(D)
(DBV)
SYMBOL
†
−40°C to 125°C
4.5 mV
TLV2371QDRQ1
TLV2371QDBVRQ1
†
Product Preview
TLV2372 AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP
V
IO
MAX AT
25°C
T
A
SMALL OUTLINE
(D)
(DGK)
SYMBOL
†
−40°C to 125°C
4.5 mV
TLV2372QDRQ1
TLV2372QDGKRQ1
†
Product Preview
TLV2374 AVAILABLE OPTIONS
PACKAGED DEVICES
SMALL OUTLINE TSSOP
V
IO
MAX AT
25°C
T
A
(D)
(PW)
−40°C to 125°C
4.5 mV
TLV2374QDRQ1
TLV2374QPWRQ1
2
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