TLC5945
www.ti.com
SLVS755–MARCH 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TA
PACKAGE(1)
PART NUMBER
TLC5945PWP
TLC5945RHB
–40°C to 85°C
–40°C to 85°C
28-pin HTSSOP PowerPAD™
32-pin 5 mm x 5 mm QFN
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI Web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS.
over operating free-air temperature range (unless otherwise noted)(1)
UNIT
–0.3 V to 6 V
90 mA
VI
IO
VI
Input voltage range(2)
Output current (dc)
Input voltage range
VCC
V(BLANK), V(SCLK), V(XLAT), V(MODE), V(SIN), V(GSCLK), V(IREF), V(TEST)
V(SOUT), V(XERR)
–0.3 V to VCC +0.3 V
–0.3 V to VCC +0.3 V
–0.3 V to 18 V
2 kV
VO
Output voltage range
V(OUT0) to V(OUT15)
HBM (JEDEC JESD22-A114, Human Body Model)
CDM (JEDEC JESD22-C101, Charged Device Model)
ESD rating
500 V
Tstg
TA
Storage temperature range
–55°C to 150°C
–40°C to 85°C
31.58°C/W
Operating ambient temperature range
HTSSOP (PWP)(4)
QFN (RHB)(4)
Package thermal impedance(3)
35.9°C/W
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) With PowerPAD soldered on PCB with 2-oz. trace of copper. See TI application report SLMA002 for further information.
2
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