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SLVS755 – MARCH 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
–40°C to 85°C
–40°C to 85°C
(1)
PACKAGE
(1)
28-pin HTSSOP PowerPAD™
32-pin 5 mm x 5 mm QFN
PART NUMBER
TLC5945PWP
TLC5945RHB
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI Web site at
ABSOLUTE MAXIMUM RATINGS.
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
V
I
I
O
V
I
V
O
Input voltage range
(2)
Output current (dc)
Input voltage range
Output voltage range
ESD rating
T
stg
T
A
Storage temperature range
Operating ambient temperature range
Package thermal impedance
(3)
(1)
(2)
(3)
(4)
HTSSOP (PWP)
(4)
QFN (RHB)
(4)
V
(BLANK)
, V
(SCLK)
, V
(XLAT)
, V
(MODE)
, V
(SIN)
, V
(GSCLK)
, V
(IREF)
, V
(TEST)
V
(SOUT)
, V
(XERR)
V
(OUT0)
to V
(OUT15)
HBM (JEDEC JESD22-A114, Human Body Model)
CDM (JEDEC JESD22-C101, Charged Device Model)
VCC
–0.3 V to 6 V
90 mA
–0.3 V to V
CC
+0.3 V
–0.3 V to V
CC
+0.3 V
–0.3 V to 18 V
2 kV
500 V
–55°C to 150°C
–40°C to 85°C
31.58°C/W
35.9°C/W
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
The package thermal impedance is calculated in accordance with JESD 51-7.
With PowerPAD soldered on PCB with 2-oz. trace of copper. See TI application report SLMA002 for further information.
2
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