TL496C, TL496Y
9-VOLT POWER-SUPPLY CONTROLLERS
SLVS012B – AUGUST 1978 – REVISED AUGUST 1995
TL496Y chip information
This chip, when properly assembled, displays characteristics similar to the TL496C. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(4)
CHIP THICKNESS: 15 MILS TYPICAL
(3)
BONDING PADS: 4 × 4 MILS MINIMUM
(5)
T max= 150°C
J
TOLERANCES ARE ±10%
ALL DIMENSIONS ARE IN MILS
(6)
(7)
68
(2)
(8)
(1)
74
(1)
(2)
(3)
(8)
(7)
(6)
FEEDBACK
OUTPUT
2C INPUT
1C INPUT
GND
SW
TL496Y
(4)
(5)
T INPUT
GND
4–2
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