PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TL082IDR
TL082IDR
SOIC
SOIC
TSSOP
SOIC
SOIC
SO
D
D
8
2500
2500
2000
2500
2500
2000
2500
2500
2500
2000
2500
2500
2500
340.5
367.0
367.0
367.0
333.2
367.0
333.2
333.2
333.2
367.0
333.2
367.0
367.0
338.1
367.0
367.0
367.0
345.9
367.0
345.9
345.9
345.9
367.0
345.9
367.0
367.0
20.6
35.0
35.0
38.0
28.6
38.0
28.6
28.6
28.6
35.0
28.6
38.0
38.0
8
TL082IPWR
TL084ACDR
TL084ACDR
TL084ACNSR
TL084BCDR
TL084CDR
PW
D
8
14
14
14
14
14
14
14
14
14
14
D
NS
D
SOIC
SOIC
SOIC
TSSOP
SOIC
SOIC
SOIC
D
TL084CDRG4
TL084CPWR
TL084IDR
D
PW
D
TL084QDR
TL084QDRG4
D
D
Pack Materials-Page 3
TI [ TEXAS INSTRUMENTS ]
