TL061, TL061A, TL061B, TL061Y, TL062, TL062A
TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y
LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS078F – NOVEMBER 1978 – REVISED JANUARY 1999
TL064Y chip information
This chip, when properly assembled, has characteristics similar to the TL064. Thermal compression or
ultrasonic bonding can be used on the doped-aluminum bonding pads. The chips can be mounted with
conductive epoxy or a gold-silicon preform.
VCC+
(4)
+
–
+
–
+
–
+
–
(1)
(7)
(11)
VCC–
Chip Thickness: 15 Mils Typical
Bonding Pads: 4
×
4 Mils Minimum
TJ(max) = 150°C
Tolerances Are
±10%.
All Dimensions Are in Mils.
Pin (11) is Internally Connected
to Backside of Chip.
(12)
(13)
3IN+
3IN–
(5)
(6)
(8)
4OUT
2IN+
2IN–
(1)
1OUT
Bonding-Pad Assignments
1IN+
(13)
(12) (11)
(10)
(9)
1IN–
2OUT
(14)
(8)
4IN+
4IN–
60
3OUT
(3)
(2)
(7)
(10)
(9)
(14)
(2)
(3)
(4)
110
(5)
(6)
6
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