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THS4531 参数 Datasheet PDF下载

THS4531图片预览
型号: THS4531
PDF下载: 下载PDF文件 查看货源
内容描述: 超低功耗,轨到轨输出,全差动放大器 [Ultra Low Power, Rail-to-Rail Output, Fully-Differential Amplifier]
分类和应用: 放大器
文件页数/大小: 54 页 / 1182 K
品牌: TI [ TEXAS INSTRUMENTS ]
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THS4531  
SLOS358B SEPTEMBER 2011REVISED MARCH 2012  
www.ti.com  
EVM AND LAYOUT RECOMMENDATIONS  
The THS4531 EVM (SLOU334) should be used as a reference when designing the circuit board. It is  
recommended to follow the EVM layout of the external components near to the amplifier, ground plane  
construction, and power routing as closely as possible. General guidelines are:  
1. Signal routing should be direct and as short as possible into and out of the op amp.  
2. The feedback path should be short and direct avoiding vias if possible.  
3. Ground or power planes should be removed from directly under the amplifier’s input and output pins.  
4. A series output resistor is recommended to be placed as near to the output pin as possible. See Figure 78  
“Recommended Series Output Resistor vs. Capacitive Load” for recommended values given expected  
capacitive load of design.  
5. A 2.2µF power supply decoupling capacitor should be placed within 2 inches of the device and can be  
shared with other op amps. For split supply, a capacitor is required for both supplies.  
6. A 0.1µF power supply decoupling capacitor should be placed as near to the power supply pins as possible.  
Preferably within 0.1 inch. For split supply, a capacitor is required for both supplies.  
7. The PD pin uses TTL logic levels referenced to the negative supply voltage (VS-). When not used it should  
tied to the positive supply to enable the amplifier. When used, it must be actively driven high or low and  
should not be left in an indeterminate logic state. A bypass capacitor is not required, but can be used for  
robustness in noisy environments.  
42  
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Copyright © 2011–2012, Texas Instruments Incorporated  
Product Folder Link(s): THS4531  
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