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SN74LS07DRG4 参数 Datasheet PDF下载

SN74LS07DRG4图片预览
型号: SN74LS07DRG4
PDF下载: 下载PDF文件 查看货源
内容描述: HEX缓冲器/带集电极开路高压输出驱动程序 [HEX BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS]
分类和应用: 栅极触发器逻辑集成电路光电二极管输出元件高压驱动
文件页数/大小: 13 页 / 508 K
品牌: TI [ TEXAS INSTRUMENTS ]
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
SN74LS07D
SN74LS07DBLE
SN74LS07DBR
SN74LS07DBRE4
SN74LS07DBRG4
SN74LS07DE4
SN74LS07DG4
SN74LS07DR
SN74LS07DRE4
SN74LS07DRG4
SN74LS07N
SN74LS07NE4
SN74LS07NSR
SN74LS07NSRE4
SN74LS07NSRG4
SN74LS17D
SN74LS17N
(1)
Status
(1)
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
OBSOLETE
Package
Type
SOIC
SSOP
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
SO
SO
SOIC
PDIP
Package
Drawing
D
DB
DB
DB
DB
D
D
D
D
D
N
N
NS
NS
NS
D
N
Pins Package Eco Plan
(2)
Qty
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
50
Green (RoHS &
no Sb/Br)
TBD
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
50
50
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Call TI
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
Call TI
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
25
Pb-Free
(RoHS)
Pb-Free
(RoHS)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
TBD
TBD
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1