PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LVC08ADBR
SN74LVC08ADR
SN74LVC08ADR
SN74LVC08ADT
SN74LVC08ANSR
SN74LVC08APWR
SN74LVC08ARGYR
SSOP
SOIC
SOIC
SOIC
SO
DB
D
14
14
14
14
14
14
14
2000
2500
2500
250
346.0
346.0
333.2
346.0
346.0
346.0
346.0
346.0
346.0
345.9
346.0
346.0
346.0
346.0
33.0
33.0
28.6
33.0
33.0
29.0
29.0
D
D
NS
PW
RGY
2000
2000
3000
TSSOP
VQFN
Pack Materials-Page 2