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SN74LVC1G3157DCKR 参数 Datasheet PDF下载

SN74LVC1G3157DCKR图片预览
型号: SN74LVC1G3157DCKR
PDF下载: 下载PDF文件 查看货源
内容描述: 单刀双掷模拟开关 [SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH]
分类和应用: 复用器开关复用器或开关信号电路光电二极管
文件页数/大小: 16 页 / 312 K
品牌: TI [ TEXAS INSTRUMENTS ]
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SN74LVC1G3157
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH
SCES424C – JANUARY 2003 - REVISED SEPTEMBER 2003
D
D
D
D
D
D
D
D
D
1.65-V to 5.5-V V
CC
Operation
Useful for Both Analog and Digital
Applications
Specified Break-Before-Make Switching
Rail-to-Rail Signal Handling
High Degree of Linearity
High Speed, Typically 0.5 ns
(V
CC
= 3 V, C
L
= 50 pF)
Low On-State Resistance, Typically
≈6 Ω
(V
CC
= 4.5 V)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV OR DCK PACKAGE
(TOP VIEW)
B2
GND
B1
1
2
3
6
5
4
S
V
CC
A
YEP OR YZP PACKAGE
(BOTTOM VIEW)
B1
GND
B2
3 4
2 5
1 6
A
V
CC
S
description/ordering information
This single-pole, double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G3157 can handle both analog and digital signals. The device permits signals with amplitudes
of up to V
CC
(peak) to be transmitted in either direction.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
TA
PACKAGE†
NanoStar – WCSP (DSBGA)
0.23-mm Large Bump – YEP
–40°C 85°C
–40 C to 85 C
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
ORDERABLE
PART NUMBER
SN74LVC1G3157YEPR
Tape and reel
SN74LVC1G3157YZPR
Tape and reel
Tape and reel
SN74LVC1G3157DBVR
SN74LVC1G3157DCKR
CC5_
C5_
_ _ _C5_
TOP-SIDE
MARKING‡
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
1