SCES296Y
–
FEBRUARY 2000
–
REVISED JUNE 2011
Table 3. FUNCTION TABLE
INPUT
A
L
H
OUTPUT
Y
L
Z
LOGIC DIAGRAM (POSITIVE LOGIC)
(DBV, DCK, DRL, DSF, DRY, and YZP Package)
A
2
4
Y
LOGIC DIAGRAM (POSITIVE LOGIC)
(YZV Package)
A
1
3
Y
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
V
CC
V
I
V
O
V
O
I
IK
I
OK
I
O
Supply voltage range
Input voltage range
(2)
Voltage range applied to any output in the high-impedance or power-off state
Voltage range applied to any output in the high or low state
(2)
Input clamp current
Output clamp current
Continuous output current
Continuous current through V
CC
or GND
DBV package
DCK package
DRL package
θ
JA
Package thermal impedance
(4)
DRY package
DSF package
YZP package
YZV package
T
stg
(1)
(2)
(3)
(4)
Storage temperature range
–65
V
I
<
0
V
O
<
0
(3)
(2)
MAX
6.5
6.5
6.5
6.5
–50
–50
±50
±100
206
252
142
234
300
132
116
150
UNIT
V
V
V
V
mA
mA
mA
mA
–0.5
–0.5
–0.5
–0.5
°C/W
°C
Stresses beyond those listed under
"absolute
maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
"recommended
operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of V
CC
is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
Copyright
©
2000–2011, Texas Instruments Incorporated
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