PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC04DBR
SN74HC04DR
SSOP
SOIC
DB
D
14
14
14
14
14
14
14
14
2000
2500
2500
2500
2500
250
367.0
367.0
333.2
367.0
333.2
367.0
367.0
367.0
367.0
367.0
345.9
367.0
345.9
367.0
367.0
367.0
38.0
38.0
28.6
38.0
28.6
38.0
35.0
35.0
SN74HC04DR
SOIC
D
SN74HC04DRG4
SN74HC04DRG4
SN74HC04DT
SOIC
D
SOIC
D
SOIC
D
SN74HC04PWR
SN74HC04PWT
TSSOP
TSSOP
PW
PW
2000
250
Pack Materials-Page 2