PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
SN74AS867DWRE4
SN74AS867DWRG4
SN74AS867NT
SN74AS867NT3
SN74AS867NTE4
SN74AS869DW
SN74AS869DWE4
SN74AS869DWG4
SN74AS869DWR
SN74AS869DWRE4
SN74AS869DWRG4
SN74AS869NT
SN74AS869NT3
SN74AS869NTE4
SNJ54AS867FK
SNJ54AS867JT
SNJ54AS867W
SNJ54AS869FK
SNJ54AS869JT
SNJ54AS869W
(1)
Status
(1)
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOIC
SOIC
PDIP
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
PDIP
LCCC
CDIP
CFP
LCCC
CDIP
CFP
Package
Drawing
DW
DW
NT
NT
NT
DW
DW
DW
DW
DW
DW
NT
NT
NT
FK
JT
W
FK
JT
W
Pins Package Eco Plan
(2)
Qty
24
24
24
24
24
24
24
24
24
24
24
24
24
24
28
24
24
28
24
24
15
1
1
1
1
1
1
15
25
25
25
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
15
Pb-Free
(RoHS)
TBD
Pb-Free
(RoHS)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
Call TI
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
Call TI
N / A for Pkg Type
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
15
Pb-Free
(RoHS)
TBD
Pb-Free
(RoHS)
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 2
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