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SN74ACT32DRE4 参数 Datasheet PDF下载

SN74ACT32DRE4图片预览
型号: SN74ACT32DRE4
PDF下载: 下载PDF文件 查看货源
内容描述: 四路2输入正或门 [QUADRUPLE 2-INPUT POSITIVE-OR GATES]
分类和应用: 栅极触发器逻辑集成电路光电二极管输入元件
文件页数/大小: 12 页 / 355 K
品牌: TI [ TEXAS INSTRUMENTS ]
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
SN74ACT32D
SN74ACT32DBLE
SN74ACT32DBR
SN74ACT32DBRE4
SN74ACT32DE4
SN74ACT32DR
SN74ACT32DRE4
SN74ACT32N
SN74ACT32NE4
SN74ACT32NSR
SN74ACT32NSRE4
SN74ACT32PW
SN74ACT32PWE4
SN74ACT32PWLE
SN74ACT32PWR
SN74ACT32PWRE4
(1)
Status
(1)
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
Package
Type
SOIC
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
PDIP
PDIP
SO
SO
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
Package
Drawing
D
DB
DB
DB
D
D
D
N
N
NS
NS
PW
PW
PW
PW
PW
Pins Package Eco Plan
(2)
Qty
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
50
Green (RoHS &
no Sb/Br)
TBD
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
50
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
25
Pb-Free
(RoHS)
Pb-Free
(RoHS)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
90
90
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
TBD
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1