ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉ ꢊꢋ ꢌ ꢀꢁꢍ ꢃ ꢄ ꢅꢆ ꢇꢈ ꢉꢊ ꢋ
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢉ ꢃꢋ ꢌ ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢉꢋ
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SLLS562D − MARCH 2003 − REVISED SEPTEMBER 2005
DGK Package
THERMAL CHARACTERISTICS
PARAMETER
TEST CONDITIONS
Low-k board, no air flow
MIN
TYP
266
MAX
UNIT
(2)
(1)
Θ
JA
Junction-to-ambient thermal resistance
°C/W
(3)
High-k board, no air flow
180
108
66
(3)
Θ
Θ
Junction-to-board thermal resistance
Junction-to-case thermal resistance
High-k board, no air flow
JB
°C/W
JC
R
= 54 Ω, Input to D is a 200 kbps
L
50% duty cycle square wave
P
P
P
Average power dissipation
Average power dissipation
HVD3082E
HVD3085E
HVD3088E
203
205
276
mW
(AVG)
(AVG)
(AVG)
V
at 5.5 V, T = 130°C
cc
J
R
= 54 Ω, Input to D is a 1 Mbps
L
50% duty cycle square wave
mW
mW
V
cc
at 5.5 V, T = 130°C
J
R
= 54 Ω, Input to D is a 20 Mbps
L
Average power dissipation
Ambient air temperature
50% duty cycle square wave
at 5.5 V, T = 130°C
V
cc
J
High k board model
Low k board model
−40
−40
93
75
T
A
°C
°C
T
SD
Thermal shut-down junction temperature
165
(1)
(2)
(3)
See TI application note literature number SZZA003, Package Thermal Characterization Methodologies, for an explanation of this parameter.
JESD51-3 Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
11
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