PACKAGE OPTION ADDENDUM
www.ti.com
18-Feb-2005
PACKAGING INFORMATION
Orderable Device
RC4558D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
8
8
8
8
75
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
RC4558DGKR
RC4558DR
MSOP
SOIC
DGK
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
RC4558ID
SOIC
D
75
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
RC4558IDGKR
RC4558IDR
RC4558IP
MSOP
SOIC
DGK
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
P
50
150
2000
50
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-NC-NC-NC
RC4558IPW
RC4558IPWR
RC4558P
TSSOP
TSSOP
PDIP
PW
PW
P
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
RC4558PSLE
RC4558PSR
OBSOLETE
ACTIVE
SO
SO
PS
PS
8
8
None
Call TI
Call TI
2000
150
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
RC4558PW
ACTIVE
TSSOP
PW
8
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
RC4558PWLE
RC4558PWR
OBSOLETE TSSOP
ACTIVE TSSOP
PW
PW
8
8
None
Call TI
Call TI
2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
RC4558Y
OBSOLETE XCEPT
Y
0
None
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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