PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
PACKAGING INFORMATION
Orderable Device
PTH03060YAH
PTH03060YAS
PTH03060YAST
PTH03060YAZ
PTH03060YAZT
PTH05060YAH
PTH05060YAS
PTH05060YAST
PTH05060YAZ
PTH05060YAZT
PTH12060YAH
PTH12060YAS
PTH12060YAST
PTH12060YAZ
PTH12060YAZT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
DIP MOD
ULE
EUW
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
36
Pb-Free
(RoHS)
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N / A for Pkg Type
DIP MOD
ULE
EUY
EUY
EUY
EUY
EUW
EUY
EUY
EUY
EUY
EUW
EUY
EUY
EUY
EUY
36
TBD
Level-1-235C-UNLIM
Level-1-235C-UNLIM
Level-3-260C-168 HR
Level-3-260C-168 HR
N / A for Pkg Type
DIP MOD
ULE
250
36
TBD
DIP MOD
ULE
Pb-Free
(RoHS)
DIP MOD
ULE
250
36
Pb-Free
(RoHS)
DIP MOD
ULE
Pb-Free
(RoHS)
DIP MOD
ULE
36
TBD
Level-1-235C-UNLIM
Level-1-235C-UNLIM
Level-3-260C-168 HR
Level-3-260C-168 HR
N / A for Pkg Type
DIP MOD
ULE
250
36
TBD
DIP MOD
ULE
Pb-Free
(RoHS)
DIP MOD
ULE
250
36
Pb-Free
(RoHS)
DIP MOD
ULE
Pb-Free
(RoHS)
DIP MOD
ULE
36
TBD
Level-1-235C-UNLIM
Level-1-235C-UNLIM
Level-3-260C-168 HR
Level-3-260C-168 HR
DIP MOD
ULE
250
36
TBD
DIP MOD
ULE
Pb-Free
(RoHS)
DIP MOD
ULE
250
Pb-Free
(RoHS)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1