欢迎访问ic37.com |
会员登录 免费注册
发布采购

PTH05060YAS 参数 Datasheet PDF下载

PTH05060YAS图片预览
型号: PTH05060YAS
PDF下载: 下载PDF文件 查看货源
内容描述: 存储器总线终端模块 [MEMORY BUS TERMINATION MODULES]
分类和应用: 存储
文件页数/大小: 19 页 / 838 K
品牌: TI [ TEXAS INSTRUMENTS ]
 浏览型号PTH05060YAS的Datasheet PDF文件第11页浏览型号PTH05060YAS的Datasheet PDF文件第12页浏览型号PTH05060YAS的Datasheet PDF文件第13页浏览型号PTH05060YAS的Datasheet PDF文件第14页浏览型号PTH05060YAS的Datasheet PDF文件第16页浏览型号PTH05060YAS的Datasheet PDF文件第17页浏览型号PTH05060YAS的Datasheet PDF文件第18页浏览型号PTH05060YAS的Datasheet PDF文件第19页  
PACKAGE OPTION ADDENDUM  
www.ti.com  
12-Jan-2006  
PACKAGING INFORMATION  
Orderable Device  
PTH03060YAH  
PTH03060YAS  
PTH03060YAST  
PTH03060YAZ  
PTH03060YAZT  
PTH05060YAH  
PTH05060YAS  
PTH05060YAST  
PTH05060YAZ  
PTH05060YAZT  
PTH12060YAH  
PTH12060YAS  
PTH12060YAST  
PTH12060YAZ  
PTH12060YAZT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
DIP MOD  
ULE  
EUW  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
36  
Pb-Free  
(RoHS)  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
N / A for Pkg Type  
DIP MOD  
ULE  
EUY  
EUY  
EUY  
EUY  
EUW  
EUY  
EUY  
EUY  
EUY  
EUW  
EUY  
EUY  
EUY  
EUY  
36  
TBD  
Level-1-235C-UNLIM  
Level-1-235C-UNLIM  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
N / A for Pkg Type  
DIP MOD  
ULE  
250  
36  
TBD  
DIP MOD  
ULE  
Pb-Free  
(RoHS)  
DIP MOD  
ULE  
250  
36  
Pb-Free  
(RoHS)  
DIP MOD  
ULE  
Pb-Free  
(RoHS)  
DIP MOD  
ULE  
36  
TBD  
Level-1-235C-UNLIM  
Level-1-235C-UNLIM  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
N / A for Pkg Type  
DIP MOD  
ULE  
250  
36  
TBD  
DIP MOD  
ULE  
Pb-Free  
(RoHS)  
DIP MOD  
ULE  
250  
36  
Pb-Free  
(RoHS)  
DIP MOD  
ULE  
Pb-Free  
(RoHS)  
DIP MOD  
ULE  
36  
TBD  
Level-1-235C-UNLIM  
Level-1-235C-UNLIM  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
DIP MOD  
ULE  
250  
36  
TBD  
DIP MOD  
ULE  
Pb-Free  
(RoHS)  
DIP MOD  
ULE  
250  
Pb-Free  
(RoHS)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Addendum-Page 1