ABSOLUTE MAXIMUM RATINGS(1)
PIN CONFIGURATIONS
Supply Voltage .................................................................................. ±18V
Input Voltage Range .............................................. +VS + 2V to –VS – 2V
Differential Input Range....................................................... Total VS + 4V
Power Dissipation ........................................................................ 1000mW
Operating Temperature
M Package .................................................................. –55°C to +125°C
P, U Package ............................................................. –40°C to +125°C
Storage Temperature
Top View
DIP/SOIC
Offset Trim
–In
1
2
3
4
8
7
6
5
No Internal Connection
+VS
+In
Output
Offset Trim
M Package .................................................................. –65°C to +150°C
P, U Package ............................................................. –40°C to +125°C
Junction Temperature
–VS
M Package .................................................................................. +175°C
P, U Package ............................................................................. +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
SOlC (soldering, 3s) ................................................................... +260°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
TO-99
Top View
No Internal Connection
8
PACKAGE/ORDERING INFORMATION
+VS
Offset Trim
PACKAGE DRAWING
NUMBER(1)
TEMPERATURE
RANGE
1
7
PRODUCT
PACKAGE
OPA627AP
OPA627BP
OPA627AU
OPA627AM
OPA627BM
OPA627SM
Plastic DIP
Plastic DIP
SOIC
TO-99 Metal
TO-99 Metal
TO-99 Metal
006
006
182
001
001
001
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–55°C to +125°C
–In
2
Output
6
3
5
+In
OPA637AP
OPA637BP
OPA637AU
OPA637AM
OPA637BM
OPA637SM
Plastic DIP
Plastic DIP
SOIC
TO-99 Metal
TO-99 Metal
TO-99 Metal
006
006
182
001
001
001
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–55°C to +125°C
4
Offset Trim
–VS
Case connected to –VS.
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
®
3
OPA627, 637
TI [ TEXAS INSTRUMENTS ]
