CONNECTION DIAGRAMS
Top View
PACKAGE/ORDERING INFORMATION
Tab is connected
to V– supply.
5-Lead
Surface Mount
Tab is connected
to V– supply.
5-Lead TO-220
and
Stagger-Formed
TO-220
PRODUCT
OPA544T
PACKAGE
5-Lead TO-220
PACKAGE DRAWING
NUMBER
(1)
315
323
325
OPA544T-1 5-Lead Stagger-Formed TO-220
OPA544F
5-Lead Surface-Mount
1 2 3 4 5
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
1 2 3 4 5
+
V
IN
V–
V+
–
V
IN
V
O
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
+
V
IN
V–
V+
–
V
IN
V
O
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V– ................................................................... 70V
Output Current ................................................................. See SOA Curve
Input Voltage .................................................... (V–) –0.7V to (V+) +0.7V
Operating Temperature ................................................. –40°C to +125°C
Storage Temperature ..................................................... –40°C to +125°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering –10s)
(1) ...............................................................
300°C
NOTE: (1) Vapor-phase or IR reflow techniques are recommended for solder-
ing the OPA544F surface mount package. Wave soldering is not recommended
due to excessive thermal shock and “shadowing” of nearby devices.
®
3
OPA544
TI [ TEXAS INSTRUMENTS ]
