SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013
PIN CONFIGURATIONS
DCK PACKAGE
SC70-5
(TOP VIEW)
+IN
V-
-IN
1
2
3
4
OUT
5
V+
D, DGK PACKAGES
SO-8, MSOP-8
(TOP VIEW)
OUT A
-IN
A
+IN A
V-
1
2
3
4
8
7
6
5
V+
OUT B
-IN
B
+IN B
DBV PACKAGE
SOT23-5
(TOP VIEW)
OUT
V-
+IN
1
2
3
4
-IN
5
V+
OUT A
-IN
A
+IN A
V-
DRG PACKAGE
(1)
DFN-8
(TOP VIEW)
1
2
3
4
Exposed
Thermal
Die Pad
on
Underside
(2)
8
7
6
5
V+
OUT B
-IN
B
+IN B
PW PACKAGE
TSSOP-14
(TOP VIEW)
OUT A
-IN
A
+IN A
V+
+IN B
-IN
B
OUT B
1
2
3
4
5
6
7
B
C
A
D
14
13
12
11
10
9
8
OUT D
-IN
D
+IN D
V-
+IN C
-IN
C
OUT C
(1) Pitch: 0,65 mm.
(2) Connect thermal pad to V–. Pad size: 1,8 mm × 1,5 mm.
8
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