PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPA2336E/250
OPA2336E/2K5
OPA2336EA/250
OPA2336U/2K5
OPA336N/250
OPA336N/3K
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
D
8
8
250
2500
250
210.0
367.0
210.0
367.0
180.0
203.0
180.0
180.0
180.0
203.0
180.0
180.0
203.0
367.0
367.0
210.0
367.0
185.0
367.0
185.0
367.0
180.0
203.0
180.0
180.0
180.0
203.0
180.0
180.0
203.0
367.0
367.0
185.0
367.0
35.0
35.0
35.0
35.0
18.0
35.0
18.0
18.0
18.0
35.0
18.0
18.0
35.0
35.0
35.0
35.0
35.0
8
8
2500
250
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
D
5
5
3000
3000
250
OPA336N/3K
5
OPA336NA/250
OPA336NA/3K
OPA336NA/3K
OPA336NJ/250
OPA336NJ/3K
OPA336NJ/3K
OPA336U/2K5
OPA336UA/2K5
OPA4336EA/250
OPA4336EA/2K5
5
5
3000
3000
250
5
5
5
3000
3000
2500
2500
250
5
8
SOIC
D
8
SSOP
DBQ
DBQ
16
16
SSOP
2500
Pack Materials-Page 2